PI Film Kaneka-Apical

Apical Polyimide Film from KANEKA CORPORATION

Product Description:
Apical® is a highly functional film with super heat resistance. It is widely used as a heat-resistant insulation material for aircraft engines and railway engines, and as a substrate material for flexible printed circuit boards in smart phones, automobiles, notebook PCs, industrial controls and medical products.

In 1995, KANEKA CORPORATION introduced the Apical AH series of polyimide films with thicknesses ranging from 12.5 to 22.5um. After that, we successfully developed Apical NPI series products with high dimensional stability, improved elongation at break which is 30% higher than that of AN, and lower coefficient of linear expansion, which is suitable for high density and microfabricated circuits. In 2000, Apical HP series products were introduced to the market, its elongation at break is 50% higher than that of NPI, its linear thermal expansion coefficient is 30% lower, and its moisture absorption rate and hygroscopic expansion coefficient are 50% lower than that of NPI, which shows strong competitiveness in the field of TAB, COF and other areas.


Material properties:
Good flame retardance (V-0.VTM-0)
Good chemical resistance
Good dimensional stability (low coefficient of linear expansion almost equal to copper in the temperature range of 100-20°C)
Isotropic control properties

Applications:
Flexible copper clad laminates
Overlay films
FPC reinforcing sheets
Heat resistant protective film
Aircraft wire covering materials
Motor and engine wire covering material

Product Model:
APICAL 110CR:
APICAL L50CR11:
APICAL AH: General Grade
APICAL NPI: Excellent dimensional stability
APICAL AH: FEP heat sealable grade
APCAL AV: Polyimide substrate for FPC